Quick Asked: Flipchip International Contact Us?
Last update: 01 May, 2024 
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What are flipchip packages? FlipChip packages are quite popular today and you can find them in small devices such as cell phones where space is at a premium. Essentially, the name “FlipChip” describes the method used to connect a semiconductor die to a substrate.What does a flip chip bumping company do? Provider of flip chip bumping and advanced wafer level packaging services intended to provide engineering excellence in device miniaturization and innovation.How do you connect flip chips to a circuit? To attach the flip chip into a circuit, the chip is inverted to bring the solder dots down onto connectors on the underlying electronics or circuit board. The solder is then re-melted to produce an electrical connection, typically using a Thermosonic bonding or alternatively reflow solder process.What is flipflipchip substrate? FlipChip substrate is a small PCB located inside the package and is very similar to any other PCB. The difference is that the substrate size is much smaller than most of the PCBs you have seen. Substrate design consists of layout of all signals from the package external balls to the bump pads.
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FlipChip
About Us FlipChip’s Phoenix, AZ based facility is a state of the art 16,000- ft2 (4700 m2), class 1000 clean room. In addition to offering the industry’s broadest assortment of wafer bumping options, FlipChip has maintained an aggressive program to develop and generate intellectual property for future implementation at FlipChip-Phoenix and in our Asian factory locations.